LG-3200
SHUZ TUNG(WisePioneer) MACHINERY INDUSTRIAL CO., LTD.
Applications
Semiconductor wafer packaging, testing and other related industries
Semiconductor mid-end process equipment
. For wafers: 8" & 12"
Main functions:
Laser Grooving Profile Measurement Equipment
Measurements can be performed after wafer laser grooving and before Dicing Saw according to customer requirements.
The measured wafers include 8" & 12"
Contains the following measurement items:
. Laser grooving depth measurement
. Laser grooving upper edge width measurement
. Laser grooving bottom width measurement
. Laser grooving offset measurement
Product Features:
◆Automatic measurement before Dicing Saw & after Laser Grooving
◆Fully Auto Load/ Unload/Wafer Mapping integrated design
◆Automatic measurement for result of Laser Grooving
◆8"" & 12"" Cassette (universal stage designed)
◆8""/12"" Cassette Load port switching without the need of tools
◆Can measure any point on 8""/12"" wafer
◆Programmatically for single wafer to be set any 1~99 measuring points.
◆Wafer positioning repeatability X, Y Axis :±5 um.
◆Automatic Horizontal Alignment θ:± 0.01 degrees (based on Laser Grooving)
◆Auto Focus repeatability Z-axis:±5 um
Module |
Description |
Cassette |
8"/12" Cassette Load port product switching time <60 sec. |
Wafer Type |
1. Use for Wafer Thk. 800um~100 um, |
Mapping |
For oblique/position/quantity..etc., and display on the user interface. |
Measurement Stage |
1. 8"/12" shared Wafer chuck table |
Automatic measurement |
1. Laser width |
Connectivity |
1. Online: SECS /GEM, recipe auto dowmload |
Measuring Time |
1. Time for measure 1 point on 1 Wafer (base on measuring time for 1 point = 60sec), including load/unload time. |