Module

Description

Cassette

8"/12"  Cassette Load port product switching time <60 sec.
8"/12"  Cassette Load port switching without the need of tools

Wafer Type

1. Use for Wafer Thk. 800um~100 um,  
2. Use for Wafer weight.  ≦ 1Kg,  
    (The weight include wafer ring)
3. Wafer Thk measurement repeatability accuracy±1um
4. Detectable when difference between actual loading Wafer Thk and recipe  ≧ ±10 um

Mapping

For oblique/position/quantity..etc., and display on the user interface.

Measurement Stage

1. 8"/12" shared Wafer chuck table
2. The upper and lower limits of positive and negative pressure can be set and monitored
3. Can measure any point on 8"/12" wafer and programmatically set 1~99 measuring points on single wafer.
4. Stage Flatness accuracy ≦ ± 20um
5. Wafer position repeatability accuracy X, Y Axis :±5 um.
6. Auto horizontal alignment 1. θ:± 0.01⁰ (Based on laser grooing path)
7. Auto Focus repeatability accuracy Z Axis:±5 um

Automatic measurement
& analysis items

1. Laser width
2. Laser depth
3. Laser Bottom width
4. Laser edge to seal ring
5. Laser shift
6. Time for Measuring 8 points on 1 wafer  ≦ 30min

Connectivity

1. Online:  SECS /GEM, recipe auto dowmload
     (Lot ID, Device name,Wafer Size /Thk, etc.)
2. Offline: recipe manual setting (local machine)

Measuring Time

1. Time for measure 1 point on 1 Wafer (base on measuring time for 1 point = 60sec), including load/unload time.
    Tack Time ≦  210 sec
2. Time for measure 8 point on 1 Wafer  (base on measuring time for 1 point = 60sec), including load/unload time.
    Tack Time ≦  15 min