Applications:
Semiconductor wafer packaging, testing and related industries
Semiconductor mid-end process equipment
. Front-end process: ADI, AEI, ASI….etc.
. Advanced Packaging: Wafer Thinning, Bumping process
. For wafers: 8"" & 12""

Main functions:
Fully automatic wafer inspection (macro & micro)
According to customer needs, it can perform macroscopic inspection of wafers such as: wafer corner chipping, cracks, abnormal wafer engraving, residual tin on the edge, etc. Supplemented by AI for defect classification; at the same time, it can perform microscopic inspection of wafers such as critical dimensions, offset, etc.
It can replace manual operations, improve the speed and accuracy of wafer inspection, reduce false detection rate, and automatically report, store and analyze data. Meets the needs of smart production.

· Fully automated wafer macroscopic inspection/micro inspection measurement
· AOI+AI software defect detection and classification