During the semiconductor manufacturing process, wafers undergo a variety of procedures in a high-vacuum environment, including deposition, etching, and lithography. For this reason, the ability to create stable, clean vacuum chambers has become a key part the manufacturing process. ChenFull Precision’s welding technology for large aluminum alloy and stainless steel vacuum chambers deliver the stable vacuum conditions required for semiconductor processes, ensuring purity and stability during wafer production.
The key to manufacturing these large vacuum chambers is the five-axis machining centers from WELE Mechatronic. The ultra-high rigidity of the machine body, combined with high-performance five-axis probes, controllers, tools and fixtures, enables the precise machining of large chambers, ensuring that every detail meets the meticulous standards of semiconductor manufacturing processes.
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Residual stress during the wafer grinding and cutting processes can affect wafer quality, leading to cracking or wear. Tongtai’s ultrasonic-assisted machining technology employs high-frequency vibration tools combined with grinding and impact techniques to achieve precise and efficient cutting, improving cutting efficiency while reducing material loss and surface damage.
Tongtai’s epoxy molding compound (EMC) laser repair equipment provides advanced package repair solutions that use laser technology to repair wafer defects and trim edges, increasing wafer yield and the precision of subsequent processes. This ensures the quality of products during the packaging process, further enhancing reliability and lifespan.
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Transportation between various stages of the wafer manufacturing process is a crucial part of manufacturing, as efficiently handling and maintaining a clean environment to prevent wafer contamination is vital, particularly in the stages following wafer encapsulation and testing. Sanwa Engineering provides specialized automated transport solutions for the semiconductor industry, which can be customized according to customer requirements with adjustable trajectories and comprehensive data recording and management to meet the predictive maintenance needs of Industry 4.0. CFD fluid analysis verification also ensures that wafers remain uncontaminated during transport, further helping to achieve fast and consistent product deliveries, and improving the efficiency and safety of the production process.
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At every stage of the semiconductor technology chain relies on advanced technologies and equipment, from wafer fabrication and front-end/back-end processes, to packaging and transportation. The high-precision, high-performance equipment supplied by Taiwan's machine tool industry further supports the development of the semiconductor industry, ensuring the production of high-quality semiconductor products, consolidating Taiwan's leading position and outstanding competitiveness in the global semiconductor market. Through continuous technological innovation and meticulous production processes, Taiwan continues to lead the development of global semiconductor technology.
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